

The newest product in DCB’s range provides many of the advanced features of Automatic Optical Inspection (AOI) for the cost conscious buyer. With a choice of 2M or 5M Pixel cameras fitted with Telecentric Lenses the unit can inspect down to 0402/01005 components with 15μM/11μM resolution. The same software is used on both EasyVision and UltraVision so that programmes are interchangeable, and operators can easily switch between the two.
The standard unit is fitted with an angled colour lighting system to identify solder problems and improve component identification, a laser for co-planarity is available as an option.
The full specification can be seen here
With an Industrial grade camera system using a telecentric lens picture quality is exceptional, and the 24mm x 18mm inspection frame size allows for fast scanning of all boards at full resolution. This system achieves excellent throughput rates, with exceptional fault detection whilst flagging a minimum of false calls.
With the unique, in-house developed, software EasyVision is easy to programme and user training and support ensures every user gets the best out of the system every time. Time to develop new programmes has been reduced with the model library system, with simple model based guidance for new parts. Rule based algorithms allow for multiple inspection methods and tight control over pass and fail to eliminate false calls.
Clear on-screen graphics illustrate the faults and also their location on the board, making re-work easier and quicker. Clear and simple security levels protect programme data from unauthorised modifications, whilst making it easy to modify the inspection programme for changes and alternatives.
Programming and re-work can be carried out off-line (a second software licence is included with the unit) to ensure maximum productivity.
For rapid board verification the unit can be operated in Comparator mode, comparing against a “Golden Board”, but with the speed of programming for a fully automated optical Inspection this is rarely used. There is also a first-off mode to allow full manual inspection of the first-off using synchronised CAD or placer data, thus significantly reducing the time taken comparing to paper or PC based records.
Laser IC & BGA co-planarity inspection Capability (Optional)
Automatic Optical Inspection (AOI) has become a "must have" for any PCB process. However, no matter what lighting or how many cameras are used, the need to provide consistent co-planarity inspection of IC legs, BGA’s or other important parts remains.
We are providing an ideal solution to this by directly measuring the height of each IC leg using a Scanning Laser Triangulation system. Lifted Legs is one of the hardest problems to pick up and this solution provides excellent results with both photographic and numerical data to help an operator decide how to resolve the issue. This capability within our Automatic Optical Inspection (AOI) system requires no additional programming as the system will "automatically" determine where to undertake the Laser Height profile from the optical inspection results. BGA devices can be inspected for absolute seated height and co-planarity. This unique way of inspecting IC pins means the solution to this difficult issue and investment in our Automatic Optical Inspection (AOI) system is now "future proof" at an acceptable cost.
Polarity Checking
Using the innovative lighting system it is easy to highlight even the smallest of polarity marks, ensuring all components are correctly polarised. With intelligent pattern recognition rotation can be double checked against the full pattern for that part.
Position Checking
Using a simple masking and pattern match technique components placed at any angle on the board can be checked for correct position and rotation.
Marking and labelling checks
Using a combination of OCV and OCR as well as colour (Hue, Saturation and luminance) the system can check for marking and colour coding of any components, making use of rule based algorithms to allow for alternates and colour variations.
Solder Inspection
Using the angled colour lighting capability our unique analysis software allows the system to build a profile of the solder on the joint and using multiple selections of parameters can easily cope with differences in different joints, and consistency on adjacent joints.