Press Release

Low Cost AOI saves money while improving quality

DCB Automation reduces the cost of Automatic Optical Inspection (AOI), but keeps all the important capability including solder inspection.

Halesowen, West Midlands, July 2010: DCB Automation have this month launched the new EasyVision Automatic Optical Inspection (AOI) system for use in checking populated PCB’s. The price reduction on this unit compared to its predecessor has come through reduced manufacturing costs and utilising the same software as the established Ultravision machine. The upgradeability of EasyVision allows users to start with a low cost machine and add new features as they are needed, all upgrades can be done on-site and often by the customer.

Key features of the EasyVision AOI machine are:

• 0402 component inspection
• Multi-colour angled solder inspection lighting
• Library based programming
• Off-Line Programming/Repair software included
• 450mm x 340mm board capacity
• Full OCV for component identification
• Optional Laser height/co-planarity capability (Retrofit)
• Optional Gerber data import (Retrofit)
• Optional Bar Code reader (Retrofit)

Automatic Optical Inspection (AOI) is now a key test requirement for many SMT production lines, often the low cost options available do not encompass all the capability required, especially solder inspection. With EasyVision the full solder inspection capability is provided as standard, giving test results not previously available at this level of machine. Ease of use is key at this level and the DCB Automation software, currently in use on UltraVision, delivers in this area so making both first off programming and amendments/revisions a pleasure.

False Calls is traditionally a problem with AOI, but the DCB Automation software allows for very rapid fine tuning of the programme to significantly reduce false calls whilst ensuring 100% capture of real problems. Simple repair/rework software is included to ensure that operators can carry out these functions quickly. Locating the fault on the board and identifying the exact problem is easy with a fully graphic screen showing high resolution images of the fault and the good model for comparison.

The laser option for EasyVision (fitted as standard on UltraVision) gives the capability to measure absolute component height and/or co-planarity. This is especially useful for such components as BGA’s or any other component where the solder is not visible. Giving the operator the ability to check that such devise are fitted at the right height goes a long way to avoiding any further, expensive, inspection processes. Lifted legs on IC’s are also a major issue for many and the use of the laser allows more detailed examination of this problem than optical solder inspection alone. The ability for the machine to automatically deploy the laser or for the operator to force a laser measurement gives the ultimate flexibility and allows for the speed of scanning to be optimised.